Better than standard thermal pads? The material of the Rise Ultra Soft thermal pads acts similarly to thermal paste. The consistency of the pads prevents the highest components, such as voltage regulators or VRAMs, from being subjected to excessive pressure from the cooler. In the worst case, this can cause the PCB to bend. The Rise Ultra Soft pads fill in unevenness much better, conforming better to the components and significantly improving heat transfer between the cooler and the component. But that's not the only advantage! The special material also does not dry out. Typically, silicone thermal pads bleed out over time, becoming hard and rapidly losing performance after a certain point. This is not the case with the Rise Ultra Soft thermal pads. They can be used for a significantly longer period without losing substantial performance. Need to cut them? No problem! When cutting the thermal pads, it is essential to leave the film on the pads. This allows the pads to be easily trimmed with scissors, just as easily as cutting paper. The cut edges remain perfectly clean and do not fray. The Alphacool Rise Ultra Soft thermal pads offer better performance in many ways compared to standard thermal pads and are a perfect replacement for old or underperforming pads.

Technical specifications:
L x W x H: 100 x 100 x 1 mm
Color: Gray
Specific weight ASTM D792: 3.3 g/cc
Thermal conductivity: 7.0 W/mK
Hardness ASTM 2240: 25 Shore OO
Operating temperature: -40 to +160 °C
Volume resistivity ASTM D257: 5.2 x 10^13 Ohm-m
Dielectric constant ASTM D150: 4.5 MHz
Dielectric breakdown ASTM D149: 5.5 kV/mm
Flame class UL E331100: UL94 V0
Weight: 40 g.