Name: Ryzen 5 1600
Brand: AMD
SKU: 6280988
Rating: 4.62 (47 reviews)

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The AMD Ryzen 5 1600 delivers high performance. This processor excels in gaming and multi-processing tasks. It features six cores and can handle up to 12 threads simultaneously thanks to multithreading. The base clock speed is 3.2 GHz, and with Turbo Core, the CPU can even reach up to 3.6 GHz. The processor is based on AMD's Zen Core architecture and has an unlocked multiplier for easy overclocking. It fits into the AM4 socket and supports DDR4 memory. AMD's multi-threading technology enables even better multitasking, as each processor core can process two tasks at the same time. This allows for smart multitasking, making your PC respond faster and eliminating frustrating waiting times. Thanks to AMD SenseMI Technology, the processor boasts adaptive performance. AMD SenseMI automatically ramps up the processor to peak speed when the PC requires more power for demanding tasks, ensuring that performance is available when you need it. At the same time, power consumption is kept low during normal operation. With the AMD Ryzen Master Tool, which you can download for free, you can easily overclock the CPU thanks to its unlocked multiplier. The AMD Ryzen Master also allows you to keep track of temperature and much more with ease.

Actual product image AMD Ryzen 5 1600 (AM4, 3.20 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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