The DeepCool EK720 high-performance thermal pad is the perfect solution for rapid heat transfer between electronic components that require performance, compatibility, and ease of use.

Versatile Application
The EK720 thermal pads are designed to dissipate heat from microchips to be transferred through a heatsink. As a replacement for aging and inferior pads, they enhance the thermal performance of chip components in laptops, graphics cards, gaming consoles, or other electronics.

Efficient and Effective
The high-quality material makes the EK720 very durable and offers high thermal conductivity in comparison. The deformable contact surface fills all voids and gaps between components, ensuring a precise connection. The thermal conductivity is rated at 6 W/mK, determined through standardized testing, compared to competing products with unclear methods.

Safe Handling and High User-Friendliness
The EK720 is non-electrically conductive, making it safe to use near electronic components. This makes installation on circuit boards with sensitive circuits particularly comfortable and easy.