Genesis Silicone thermal compound /m-K
8.30 W/m K, 0.50 g10 items in stock at supplier
Product details
The Genesis Silicon 701 thermal paste is a high-performance thermal grease specifically designed for efficient heat transfer between electronic components. With a thermal conductivity of 8.3 W/m·K, this paste ensures effective heat dissipation, enhancing the performance and lifespan of devices. The paste is gray in color and is offered in a convenient 0.5 g packaging that allows for easy application. It is ideal for use in computers, graphics cards, and other electronic devices where optimal heat dissipation is required. The density of 1.6 g/cm³ ensures even distribution and a reliable connection between surfaces. Please pay attention to the safety and hazard warnings to ensure safe handling.
- Thermal conductivity of 8.3 W/m·K for optimal heat transfer
- Density of 1.6 g/cm³ for even distribution
- Convenient 0.5 g packaging for easy application
- Signal word WARNING with health hazard GHS07.
Weight | 0.50 g |
Item number | 15683040 |
Manufacturer | Genesis |
Category | Thermal grease |
Manufacturer no. | NTG-1582 |
Release date | 16.4.2021 |
Thermal paste type | Heat sink compound |
Thermal conductivity | 8.30 W/m K |
Density | 1.60 g/cm³ |
Country of origin | Poland |
CO₂-Emission | |
Climate contribution |
Content | 0.20 ml |
Weight | 0.50 g |
Length | 10.80 cm |
Width | 3.20 cm |
Height | 1.20 cm |
Weight | 11 g |

- H318 Causes serious eye damage.
- H315 Causes skin irritation.
30-day right of return if unopened