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Processor family: Intel Core i7 (11xxx), Number of processor cores: 8, Memory speed: 3200 MHz, Clock speed: 3.6 GHz, Integrated graphics: No, Power dissipation (TDP): 125 W.

Core i7-11700KF

Processors

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General information

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Processor socket

http://en.wikipedia.org/wiki/List_of_Intel_microprocessors

Intel Core

http://en.wikipedia.org/wiki/Clock_signal

Processor clock frequency

Max. turbo clock rate

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

http://en.wikipedia.org/wiki/Multi-core_(computing)

http://en.wikipedia.org/wiki/Thread_%28computer_science%29

http://en.wikipedia.org/wiki/Photolithography

Lithography

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

http://en.wikipedia.org/wiki/Thermal_design_power

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

http://en.wikipedia.org/wiki/CPU_cache#Multi-level_caches

L3 Cache

Multiplier unlocked

Processor design

Transfer or the more common derivatives Gigatransfer (GT) and Megatransfer (MT) are terms used in computer technology, referring to a number of data transfers (or operations). They are most commonly used for measuring transfer rates (usually as transfers per second, GT/s, MT/s, etc.). 1 GT/s means 109 or one (US/short scale) billion transfers per second, while 1 MT/s is 106 or one million transfers per second.

http://en.wikipedia.org/wiki/Transfer_(computing)

Transfer rate

Processor

Intel technologies

Intel Technologies

Memory channels

http://de.wikipedia.org/wiki/DDR-SDRAM#Arbeitsweise

Memory type

http://de.wikipedia.org/wiki/Datenspeicher

Intel Core i7-11700KF

Key specifications

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Key specifications
Processor family	Core i7 11th Gen
Number of processor cores	8 -Core
Max. TDP	125 W
Number of threads	16
PCI express version (max.)	4
Item number	14715800

Intel Core i7-11700KF

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