Name: CPU Xeon Twelve Core 4214R 2.4 GHz
Brand: Intel
SKU: 14030281
Price: 919.14 EUR
Availability: InStock

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Intel

The Intel Xeon Twelve Core 4214R processor is a powerful 12-core CPU optimized for server applications. With a base clock speed of 2.4 GHz and a maximum turbo clock speed of 3.5 GHz, this processor offers a balanced combination of energy efficiency and performance. It is designed for the LGA 3647 socket and supports up to two sockets in a configuration, making it ideal for scalable server solutions. The CPU is part of the Intel Xeon Silver family and provides a high number of threads, facilitating the processing of multiple tasks simultaneously. With a thermal design power of 100 W, the Xeon 4214R is designed to operate efficiently even under heavy load. Additionally, it supports up to 1 TB of DDR4 RAM, which is beneficial for memory-intensive applications.

- Maximum support for 1 TB of DDR4 RAM
- 24 threads for improved multitasking capabilities
- 16.5 MB L3 cache for faster data access
- Optimized for server applications with high energy efficiency
- Supports Hyper-Threading and Speed Select Technology.

Actual product image Intel CPU Xeon Twelve Core 4214R 2.4 GHz (LGA 3647, 2.40 GHz, 12 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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