Name: ThinkSystem SR630 V3 Intel Xeon Gold 541
Brand: Lenovo
SKU: 37025852
Price: 1698.38 EUR
Availability: InStock

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Lenovo

The ThinkSystem SR630 V3 with the Intel Xeon Gold 5415+ processor is a powerful solution for modern data centers and demanding IT environments. With a clock speed of 2.9 GHz and 8 cores supporting 16 threads, this processor delivers remarkable computing power for complex applications and workloads. The processor is equipped with a 22.5 MB L3 cache, optimizing data processing speed and enhancing efficiency. Support for DDR5 RAM and an octa-channel memory architecture enable high memory capacity and speed, which is crucial for data-intensive applications. Additionally, the Intel Xeon Gold 5415+ offers a maximum turbo frequency of up to 4.1 GHz, further boosting performance when needed. These features make the processor ideal for multi-cloud computing, network, and storage workloads, as well as for use in standard data centers.

- Maximum TDP of 150 watts, optimized for energy-efficient performance
- Support for up to 4000 GB of RAM, ideal for memory-intensive applications
- PCI Express version 5 for high data transfer rates
- Integrated security features such as AES-NI and Control-flow Enforcement Technology (CET)
- Hyper-Threading technology to enhance multitasking capabilities.

Actual product image Lenovo ThinkSystem SR630 V3 Intel Xeon Gold 541 (LGA 4677, 2.90 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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