Name: ThinkSystem SR650 V3 Intel Xeon Silver 4
Brand: Lenovo
SKU: 37025850
Price: 1229 EUR
Availability: InStock

isSSR

offer

olderThan3MonthTimestamp

path

sectorId

shopArea

slug

tagIds

productDetailPageQuery

productBySlug

alternateLinks

dutchAuctionBannerLazy

alternateLinksByPath

currentAuctionEvent

Lenovo

The Lenovo ThinkSystem SR650 V3 is a powerful processor specifically designed for server and enterprise applications. With the Intel Xeon Silver 4410Y processor family, this model offers a combination of high efficiency and impressive computing power. The processor features 12 cores and supports up to 24 threads, enabling optimal processing of multiple tasks simultaneously. With a base frequency of 2.0 GHz and a maximum turbo clock frequency of up to 3.9 GHz, the SR650 V3 is capable of efficiently handling demanding applications and workloads. The processor is designed for use in server environments and supports a maximum memory capacity of up to 6 TB, making it ideal for data-intensive applications. Additionally, the SR650 V3 offers support for modern storage technologies and a variety of Intel technologies that further enhance security and performance.

- 12 processor cores and 24 threads for high multitasking performance
- Maximum internal memory of 6 TB for extensive data processing
- Support for DDR4 RAM to optimize memory performance
- Integrated Intel Software Guard Extensions (SGX) for enhanced security
- Octa-channel memory architecture for efficient data transfer.

Actual product image Lenovo ThinkSystem SR650 V3 Intel Xeon Silver 4 (LGA 4677, 2 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Your data. Your choice.

Search

Lenovo ThinkSystem SR650 V3 Intel Xeon Silver 4

Product details

Compare products

Goes with

Reviews & Ratings

Lenovo ThinkSystem SR650 V3 Intel Xeon Silver 4

Product details

Description

Specifications

Price trend

Compare products

Similar products

Sales rank in Processors

Goes with

Accessories

Reviews & Ratings

Warranty & return rates

Questions about this product

Product ratings