The static dissipative polyimide (B-768) is resistant to wave soldering processes and multiple aggressive cleaning cycles during the labeling of printed circuit boards and electronic components in the pre-processing stage. This flat, high-temperature suitable white polyimide features a glossy surface. The adhesive and the carrier material are static dissipative. The surface resistance values are within the recommended range for antistatic packaging materials according to ANSI/ESD S541-2008. UL approved; meets the requirements of MIL-STD-202G, Method 215K, with an application temperature range of -70 to 100 °C (-94 to 212 °F). A ribbon is required for printing on this material. Use part number B30-R6300.