Thermal pads are used wherever flexible material with very high thermal conductivity is required, such as in connectors, RAM water blocks, power components, and high-temperature SMD components. The new multilayer design is perfect for cooling irregularly shaped and differently positioned components. It allows for filling gaps from small scratches to visible uneven surfaces. Due to its excellent thermal conductivity, the pads can also be used for large-area components such as motherboard bridges, hard drives, and densely packed components on graphics card boards. Before use, remove the protective film from both sides of the thermal pad. As with other products in the Gelid GC-Ultimate series, the above-average thermal conductivity of up to 15 W/mK stands out.

Main features:

• High thermal conductivity of 15 W/mK – leading in its class
• Easy application
• Made from the highest quality components
• Non-conductive
• Non-corrosive, non-hardened, non-toxic

Specification:

• Dimensions: 120 x 20 x 0.5 mm
• Thermal conductivity: 15 W/mK
• Density: 3.2 g/cm³
• Hardness (Shore): 60–70 OO
• Operating temperature: -60 °C to 220 °C
• Non-conductive

It is not recommended to use a thermal pad that is compressed to more than half of its nominal thickness.