The thermal conductive pad from Tru Components is a high-performance solution for efficient heat transfer in various applications. With a thickness of 0.5 mm and a thermal conductivity of 6 W/mK, this pad provides an effective way to dissipate heat from electronic components, thereby optimizing their performance and lifespan. It is ideal for use in electronics, especially in areas where reliable heat dissipation is required. The pad is available in a convenient size of 50 mm x 50 mm, making it versatile for different applications. Additionally, it can withstand temperatures of up to 200 °C, making it suitable for demanding applications. Using a thermal conductive pad helps increase the efficiency of devices and prevent overheating.

• High-quality thermal conductivity of 6 W/mK for optimal heat transfer
• Maximum operating temperature of 200 °C for versatile applications
• Convenient size of 50 mm x 50 mm for easy integration
• Suitable for use in electronics and other technical applications.